Qualcomm will license Huawei's way of stacking two chip wafers.
Bloomberg reported on Monday that Qualcomm will license the patents behind Huawei's LogicFolding chipmaking method. LogicFolding bonds two full wafers face to face instead of shrinking transistors, lifting density 55% in tests. The multi-year deal also covers 5G, optics and AI services, and Huawei's licensing income passes seven billion dollars.
Why it mattersExport rules were built to keep Chinese chip designs out of Western products. An American firm now paying for one shows where new chip ideas are coming from.
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