TSMC will pay a rival $2 billion to build AI chip parts in New York.
TSMC signed a five-year deal worth $2 billion with its old rival GlobalFoundries on Thursday. GlobalFoundries will make silicon interposers, the flat base that lets a processor and its memory talk. Production ramps at its Malta, New York plant in the first half of 2028.
Why it mattersAdvanced packaging limits how many AI chips the world can build, and it mostly happens in Asia. A second American source makes the hardware behind your apps less fragile.
▶ Related video: TSMC's CoWoS Explained: The Packaging Tech Powering AI Chips
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